Printed Circuit Board Manufacturing Process

The current mainstream method of printed circuit board manufacturing process
is "Subtractive Method".
That is to draw the circuit pattern on the copper foil and remove the needless copper.

Clarified by Two Methods

Substractive Method

The subtractive process is to form etching resist pattern
on copper foil on the board and then etch off all the
copper foil except under etching resist, leaving a desired
conductive patters.

Additive Method

The additive process is to form a conductive pattern
on a dielectric board without copper foil by adding a metal film.

Process of Subtractive Method

There are many kinds of process method in the mainstream subtractive method

Different ways of Subtractive method

Each way is different in resist nature to through hole.

Panel plating method - Tenting method

Tenting the hole by dry film,
and protect through hole against etchant.
  • Tenting method is simple and short process.
  • As tenting the hole by dry film,
    we need enough land space to endure the tenting.
  • If the tent is broken, through hole disconnection happens.
Panel plating method - Hole filling method

To make up the tenting, fill the ink in the hole,
and protect through hole against etchant.
  • As filling the filler Inside the hole, sure through hole protection
    can be achieved.
Pattern plating method

Metal plating on the wall of the hole,
and protect through hole against etchant.
  • The process is long and complicated.
  • Metal resist by electrolytic plating,
    and sure hole protection can be achieved.
  • Through hole landless spec is available.
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